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Technology
High Speed Multilayer PCB layout designing( 22layers as on date)
Micro via, blind & buried via designs
Metal core PCB Designs
Conduction cooled PCBs
Designs with EMI/EMC guidlines
Business Model
Onsite resource placement
Offshore dedicated resource on TOM basis
Fixed cost design projects
Signal Integrity Analysis
Detailed reflection analysis for transmission lines and correction
Detailed crosstalk Analysis correction
Time delay, signal propagation, ground bounce are analysed and correction factors applied wherever required
Report containing above analysis and layer stack up for fabrication will be provided as deliverable.
Thermal Analysis
Board Level Thermal Analysis is carried out to check the temperature distribution at various zones.
Reports are generated with corrections required and mechanism to be applied during PCB fabrication for effective heat dissipation during functioning of board.
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